Stacked Packaging Laminar- Convection-Cooled Printed Circuit Using the Entropy Generation Minimization Method

Ab = heat-sink-base surface area Ac = cross-sectional area of the fin Cp = specific heat of the air EI = Elenbaas number g = gravity H = fin height h = heat transfer coefficient around fin ka = thermal conductivity of the air kh = thermal conductivity of the heat sink L = fin length N = total number of fins of the heat sink P = plate-air parameter Pe = perimeter of the fin pf = fin pitch qb = heat transfer rate to the heat sink base qf = heat transfer rate to the fin Rfin = thermal resistance of the fin Rhs = overall thermal resistance of the heat sink _ Sgen = entropy generation rate _ Sgen;hs = entropy generation rate from the heat sink T1 = ambient temperature tb = base thickness of the heat sink tf = fin thickness of the heat sink W = heat sink width z = fin space = thermal expansion coefficient f = fin efficiency = average temperature difference between the heat sink and ambient air b = temperature difference between the heat sink base and ambient air = viscosity of the air = density of the air